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| HMC1053 SOLDER IMPROVEMENTS | 20/10/2008 |
We are pleased to inform you that the Honeywell HMC1053, 3 axis magnetic sensor, is undergoing some process improvements to achieve a higher level of solder bump consistency.
This improvement will yield more consistent bump dimensions and overall solder volume consistency for better product repeatability during assembly and test operations.
The solder bump height is being adjusted downward by approximately 40% to improve the overall consistency of bumps within a part and from part-to-part. Nominal bump height of the previous process parts was approximately 0.005-0.010” and the nominal bump height of the new process parts will be approximately 0.003”-0.006”.
This change should provide you improvements during your assembly process because of more consistency in the solder on the bottom of the part. The new solder bump height products will be marked with a date code of 3308 (WWYY) and beyond. Anticipated delivery time for the first new process units will be approximately the end of October 2008.
This change will impact all future HMC1053 units as part of a continuous improvement effort.
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